The Nano eNabler™ system is used to deposit femtoliter volumes of a UV curable adhesive onto a silicon Sindex™ chip. This capability has applications in the MEMS and semiconductor industries for the bonding of intricate microfabricated parts and surface mount microelectronic components, as well as underfilling of dies. UV curable adhesives may also be mixed with nanomaterials to create patterned microstructures with unique properties.
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